![]() In order to help corporations increase their market domination and total revenue creation, the market is seeing a rising trend of mergers and acquisitions. Growing need for 3D semiconductor assembly and packaging will present numerous opportunities for both established and emerging market competitors. Opportunities For Players Operating In The Global Die Bonder Equipment Market: Mechanical unbalance of moving parts is another factor expected to cause a slow-down in market growth to a certain extent going ahead. The expansion of global die bonder equipment market is being stifled by rising demand for polymer adhesive water bonding equipment and high ownership costs. As a result, die bonder equipment is expected to rise in popularity around the world. Furthermore, rising trend towards automation in automobiles is expected to drive up demand for ICs used in various functions such as ABS, airbag control, GPS, car navigation and display, power doors and windows, and automated driving, among others, contributing to market's growth.įactors Restraining Growth Of The Global Die Bonder Equipment Market: Rising need for ICs is expected to be fueled by incline in demand for electronic systems. Introduction of stacked die technology in Internet of Things (IoT) enabled products, rising demand for semiconductor integrated circuits, increasing usage of hybrid laptops, and high-definition television are all driving revenue growth in the global die bonder equipment market. Major Factors Driving Growth Of The Global Die Bonder Equipment Market: Various processes, including eutectic bonding, soldering, adhesive bonding, and glass/silver-glass bonding are used in die bonding process. The most typical method of die bonding is to use a pin to push desired die away from the tape. Various methods such as epoxy, eutectic, soft solder, and flip chip, are also employed to attach die to the substrate. A die attaching equipment's primary duty is to pick die from wafer or waffle tray and connect it to substrate. Die binders and die attaching equipment are two terms for same thing. As a result, die bonder equipment is widely employed in semiconductor device manufacture. Other factors such as increasing complexity of semiconductor IC designs and rising demand for high-quality semiconductor ICs for wireless applications are expected to support market growth going ahead.ĭie binders are a form of semiconductor packaging and assembly equipment that is used to adhere a chip to a package or substrate. Market revenue growth is attributed to rising demand for small electronic components and increasing implementation of stacked die technology in Internet of Things (IoT) devices. The global die bonder equipment market size was significantly robust in 2020 and is expected to register a steady revenue CAGR over the forecast period. ![]()
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